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Agilent Technologies Introduces Seven High-Power Modules For Modular Power Sy bi2280176 Agilent Technologies Inc. recently introduced seven high-power modules for popular N6700 modular power system. The new modules expand the ability of test-system integrators and R&D engineers to deliver multiple channels of high power (up to 500 watts) to devices under test

TRADE NEWS: Agilent Technologies Introduces Seven High-Power Modules for Modu bi2280176 Agilent Technologies Inc. today introduced seven high-power modules for popular N6700 modular power system. The new modules expand the ability of test-system integrato..

Agilent aids NXP WiGig RFIC demo at CES bi2280176 NXP Semiconductors using test equipment from Agilent Technologies Inc. a demonstration of beam-forming technology for the next generation of communication and radar products at the International Consumer Electronics Show. View the full article HERE

High-Power Modules deliver up to 500 W to devices under test. bi2280176 Available for N6700 modular power system (MPS), 7 modules help test-system integrators and R/D engineers deliver multiple channels of high power (300 or 500 W) to DUTs. Users can mix and match any modules any of 4 MPS mainframes to create DC power system unique to application requirements. Systems, can be from 1-4 outputs, offer output changes from 0-50 V less than 2 msec, digitized ..

Agilent Technologies Introduces Seven High-Power Modules For Modular Power Sy bi2280176 Agilent Technologies Inc. recently introduced seven high-power modules for popular N6700 modular power system. The new modules expand the ability of test-system integrators and R&D engineers to deliver multiple channels of high power (up to 500 watts) to devices under test

TRADE NEWS: Agilent Technologies Introduces Seven High-Power Modules for Modu bi2280176 Agilent Technologies Inc. today introduced seven high-power modules for popular N6700 modular power system. The new modules expand the ability of test-system integrato..

TRADE NEWS: Agilent Technologies Announces Availability of Mitsubishi Electri bi2280176 Agilent Technologies Inc. today announced that the latest model library for Mitsubishi Electric?s nonlinear GaAs and GaN RF devices now available for use Agilent?..

TRADE NEWS: Agilent Technologies Electronic Test Products to be Used by NXP i bi2280176 Agilent Technologies Inc. today announced that electronic test equipment be used by NXP Semiconductors N.V. a demonstration of beam-forming technology for the next generation of communication and radar products at the International Consumer Electronics Show Las Vegas, Jan

TRADE NEWS: Agilent Technologies and Integrated Diagnostics Enter Strategic P bi2280176 Agilent Technologies Inc. and Integrated Diagnostics today announced a strategic partnership to develop assays that detect major human diseases at very early stages to im..

Agilent Technologies Announces Industry's First High-Speed Inter-Chip Complia bi2280176 Agilent Technologies Inc. recently announced the release of the first commercially available High-Speed Inter-Chip (HSIC) compliance test software for real-time oscilloscopes

Agilent Technologies Announces Availability of Mitsubishi Electric's Nonlinea bi2280176 SANTA CLARA, Calif. - Agilent Technologies Inc. (NYSE: A) today announced that the latest model library for Mitsubishi Electric's nonlinear GaAs and GaN RF devices now available for use Agilent's Advanced Design System. The upgraded library works seamlessly ADS 2009 Update 1, as well as prior ADS releases. ADS2011 and future versions also be supported. The model can be obtained ..

TRADE NEWS: Agilent Technologies Announces Availability of Mitsubishi Electri bi2280176 Agilent Technologies Inc. (NYSE: A) today announced that the latest model library for Mitsubishi Electrics ..

Agilent aids NXP WiGig RFIC demo at CES bi2280176 NXP Semiconductors using test equipment from Agilent Technologies Inc. a demonstration of beam-forming technology for the next generation of communication and radar products at the International Consumer Electronics Show. View the full article HERE



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